Phoenix International – Custom Turnkey Manufacturing Solutions

U.S. 1-888-749-4685
Outside the U.S. 1-701-451-3600

continually working toward
process improvement

At Phoenix International, our processes are highly automated to manage costs for our customers and for consistent operation with the highest reliability.

In keeping with our philosophy of being a complete electronics supplier, we offer both batch and continuous-flow capabilities to support high- and low-volume production. We support through-hole and surface-mount designs, and have a full range of test and burn-in capabilities at both PCB and final assembly levels.

Phoenix International continually works to improve the efficiency of its processes. Our continuous improvement activities are the keystone of our manufacturing quality program. Daily, continuous improvement teams work with the operators on the floor to drive increases in our productivity, safety, quality, and delivery metrics.

manufacturing
We provide full turnkey manufacturing services, offering our customers the latest in electronic manufacturing and assembly technology.

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eliminating waste, increasing profitability

Phoenix International strives for further efficiency and process improvements throughout the company by embracing a "lean manufacturing" philosophy that promotes better production controls to eliminate waste and increase profitability. Our manufacturing organization is a very metric-driven organization. We have manufacturing floor systems designed to monitor and track quality, so early detection of potential quality issues is an important part of the process. We have systems in place to monitor product yields and trends on the manufacturing equipment, tying it all together so that we know we are building a quality product every day based on the product monitoring metrics that we've developed.

Capabilities
Processes
Support

Automated Manufacturing Capabilities

High-speed, continuous-flow surface mount lines
Through-hole assembly
Automated Operator Assist stations
Pin insertion
Selective and Wave soldering
Clean and No-clean reflow soldering
Robotic gasketing, including Form in place – wet bead gasketing; cure in place
Conformal coating
Encapsulation/potting utilizing high accuracy pumps to deliver precise amounts of materials mixed in the correct ratios
Ultrasonic welding (100% leak testing to ensure seal)

Additional Processes

Staked pins
Pin insertion
Flexible Circuitry technology, including Flex Circuit Lamination and Flex Connectors
Hot bar solder
Bus bars
Membrane switches
Carbon-ink
In-circuit programming
BGA and Fine Pitch BGA

Support Services

We also offer a range of services designed to meet our customers’ needs at every level. These include:

Shipping & Supply Logistics
Vendor-Managed Inventory
Customer-Managed Inventory
Supplier Development
Warranty Analysis & Management
Advanced Technology & Materials Analysis