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MANUFACTURING
Phoenix
International® provides full turnkey manufacturing
services, offering our customers the latest in electronic manufacturing
and assembly processes. These processes
are highly automated to reduce costs for our customers and for consistent
operation with the least amount of error.
In keeping with our philosophy of being a complete electronics supplier
for our customer, we offer both batch and continuous flow capabilities
to support high and low volume production. We support thru-hole
and surface mount designs and have a full range of test and burn-in
capabilities at both PCB and final assembly levels.
With
a commitment to constant innovation and expansion of services, we
make substantial investments each year into updated technology.
We continuously evaluate our manufacturing processes and look for
new and more cost effective methods of providing customers with
quality products at competitive prices.
MANUFACTURING
HIGHLIGHTS
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Batch
and Continuous Flow Capabilities
High
Level of Automation
- Surface Mount Technology
- Through Hole Automation
- Gasketing, Conformal Coating, Potting
Full
Range of Test and Burn-in
Computer
Aided Design/Computer Aided Manufacturing Links
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MANUFACTURING
CAPABILITIES
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Printed
Circuit Board Assembly
- Surface
Mount Technology
- Through
Hole Automation
- Prototypes/
Short Run
- Pin
Insertion
- Automatic
Sequencing and Insertion
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Robotics
- Gasketing
- Conformal
Coating
- Masking
- Printed
Circuit Board Depaneling
- Point-to-Point
SolderMate
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Testing
- In-Circuit
Testing
· Genrad
- Manufacturing
Defect Analyzer
· Checksum
- Functional
Test
· Design
· Build
- Environmental
Stress Screening (ESS)
· Design
· Build
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Final
Product Assembly
Electro-Mechanical
Assembly
Total
System Supply
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